Photo Resist Removal is basically a kind of processing of plasma that helps in the fabrication of the integrated circuits. In this process glow discharge i.e., plasma stream at very high speed with a right gas mixture at sample. Etch species which are also known as plasma source can be of ions either charged or be of atoms and radicals which can be neutral in nature. During this process, volatile products are generated by plasma at room temperature. These products are produced by the result of chemical reaction that occurs between reactive species and etched material elements that generates by the plasma. Shot element atoms eventually embed themselves just below the target surface or just at the target surface, because of this target physical properties modify itself.
Application of etching of plasma
Etching of plasma is currently use for the processing of semiconducting materials, so that it can be used in an electronic fabrication. Small features etched at semiconducting material surface, so that it can become more efficient and also help to enhance some of the properties when it is used in any electronic devices. For example, Photo Resist Removal can be used to create the deep trenches on silicon surface to use in the system of micro electro-mechanical.
Types of plasma etching
Pressure influences the process of plasma etching. In order to make etching of plasma happen chamber must be under the less pressure such as 100 Pascal. To generate the plasma of low pressure, gas also need to be ionized and the ionization happens by the glow charge. Two types of etching of plasma are as follows:
Activation of plasma surface
In order to enhance the surface of the plasma or to increase the adhesion property plasma surface activation has been performed which is usually or also known as surface modification. Activation of plasma surface enhances the adhesive property of many materials such as glass, metals, and ceramics. Many Polymers and textiles and natural materials as well such as seeds and woods also enhance their properties of adhesion. It is widely use for the bonding, coating etc.
